WHAT IS LOW PRESSURE MOLDING?
Low pressure molding is a single-step process to encapsulate, seal and protect electronics. Using a simple mold set allows for the process to use much less material than traditional potting and eliminate the housing. Part numbers and logos can easily be incorporated into the mold set for added benefits.
The process is fast – producing the finished part in seconds. This unique technology is primarily used for encapsulating or overmolding of electronic assemblies, including battery packs, PCBA, micro-switches, solenoids, sensors, connectors and wire harnesses.
Some additional benefits to this technology are environmental protection from moisture and vibration, low cost delicate assemblies can be processed, no secondary curing and is environmentally friendly.